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Hi.....just picked up a 670 in which the newer (slimer) model was sent (Hardware v2.6). Once thing I noticed is that the v1 has slotted back cover and this newer version does not. Any concern with these things overheating that I should worry about before deploying. Odd that the insides are supposidly the same but would remove the vents.
thanks!
b8kedziti wrote
Hi.....just picked up a 670 in which the newer (slimer) model was sent (Hardware v2.6). Once thing I noticed is that the v1 has slotted back cover and this newer version does not. Any concern with these things overheating that I should worry about before deploying. Odd that the insides are supposidly the same but would remove the vents.
thanks!
Hi @b8kedziti
Compare with the EAP670 V1, the size of EAP670 V2 has been optimized. Actually both EAP670 V1 and V2 can easily become warm/heated since the device is typically operate 24/7. However, we can confirm it will not affect the performance of the EAP670 V2 without vents. So please feel free to mount the EAP and place it in a proper situation will be fine.
@Hank21 Thank you!
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